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Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

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    Buy cheap Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished from wholesalers
     
    Buy cheap Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished from wholesalers
    • Buy cheap Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished from wholesalers
    • Buy cheap Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished from wholesalers

    Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

    The Rogers RO4003C High Frequency PCB is a premier choice for applications demanding superior electrical performance and manufacturability. This innovative material is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that combines the beneficial properties of PTFE/woven glass with the ease of processing associated with epoxy/glass materials. The RO4003C stands out by offering excellent dielectric control and low loss at a competitive cost, making it ideal for high-volume, performance-sensitive applications.


    Key Features
    Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
    Dissipation Factor: 0.0027 at 10 GHz
    Thermal Conductivity: 0.71 W/m/°K
    Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
    Coefficient of Thermal Expansion (CTE): Matched to copper (X: 11 ppm/°C, Y: 14 ppm/°C)
    Low Z-axis CTE: 46 ppm/°C
    Glass Transition Temperature (Tg): >280 °C
    Low Moisture Absorption: 0.06%


    Benefits
    Ideal for Multi-Layer Board (MLB) Constructions: The RO4003C is designed specifically for complex PCB designs, providing excellent performance in multi-layer configurations.

    Cost-Effective Fabrication: Processes similarly to FR-4, allowing for lower fabrication costs compared to traditional microwave laminates.

    High Volume Applications: Engineered for performance-sensitive applications, making it the perfect choice for high-demand environments.

    Competitive Pricing: Offers exceptional value without compromising on quality or performance.


    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes

    In terms of technical specifications, the RO4003C features a 2-layer rigid PCB stackup, with copper layer thicknesses of 35 μm on both sides and a core thickness of 0.305 mm (12 mil). The board dimensions are 66.95 mm x 38.29 mm (± 0.15 mm), with a finished board thickness of 0.4 mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers, and the surface finish is ENEPIG.


    Typical Applications
    The Rogers RO4003C PCB is versatile and suitable for a wide range of applications, including:


    Cellular base station antennas and power amplifiers
    RF identification tags
    Automotive radar and sensors
    LNBs for direct broadcast satellites


    Availability
    The Rogers RO4003C PCB is available worldwide, designed to meet the needs of modern high-frequency applications. With its advanced material properties and cost-effective manufacturing processes, it represents a significant advancement in PCB technology.


    Roger RO4003C 12mil Two Layer Pcb Black Silkscreen ENEPIG Finished

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