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Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG

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    Buy cheap Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG from wholesalers
     
    Buy cheap Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG from wholesalers
    • Buy cheap Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG from wholesalers
    • Buy cheap Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG from wholesalers

    Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG

    Introduction
    The Rogers RO4350B High Frequency PCB is engineered for applications requiring exceptional electrical performance and manufacturability. The RO4350B materials feature proprietary woven glass reinforced hydrocarbon/ceramics that deliver electrical performance comparable to PTFE/woven glass, combined with the ease of processing found in epoxy/glass. These laminates maintain tight control over dielectric constant (Dk) while ensuring low loss, all at a fraction of the cost of conventional microwave materials. Unlike PTFE-based options, RO4350B does not require special through-hole treatments or handling procedures, making it user-friendly. Additionally, it is UL 94 V-0 rated, suitable for active devices and high-power RF designs.


    The RO4450F bondply complements the RO4350B core, consisting of several grades compatible with RO4000 laminates for multi-layer constructions. Its high postcure Tg allows it to handle multiple lamination cycles, making it ideal for applications requiring sequential laminations. The bondply is also compatible with FR-4 requirements, enabling the combination of RO4450F and low-flow FR-4 bondplies in non-homogeneous multi-layer constructions.


    Features
    RO4350B:
    Dielectric Constant (Dk): 3.48 ± 0.05 at 10 GHz/23°C
    Dissipation Factor: 0.0037 at 10 GHz/23°C
    Thermal Conductivity: 0.69 W/m/°K
    CTE: X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32 ppm/°C
    Glass Transition Temperature (Tg): >280 °C
    Water Absorption: 0.06%


    RO4350B Typical Value
    PropertyRO4350BDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0037
    0.0031
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus16,767(2,432)
    14,153(2,053)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength203(29.5)
    130(18.9)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength255
    (37)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.5X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion10
    12
    32
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td390℃ TGAASTM D 3850
    Thermal Conductivity0.69W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.86gm/cm323℃ASTM D 792
    Copper Peel Stength0.88
    (5.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    Flammability(3)V-0UL 94
    Lead-free Process CompatibleYes

    RO4450F:
    Dielectric Constant (Dk): 3.52 ± 0.05 at 10 GHz/23°C
    Dissipation Factor: 0.004 at 10 GHz/23°C
    Thermal Conductivity: 0.65 W/m/°K
    CTE: X: 19 ppm/°C, Y: 17 ppm/°C, Z: 50 ppm/°C
    Glass Transition Temperature (Tg): >280 °C
    Water Absorption: 0.04%


    Technical Specifications
    PCB Stackup: 2-layer rigid PCB

    Copper Layer 1: 35 μm
    Rogers RO4350B Core: 0.762 mm (30 mil)
    Copper Layer 2: 18 μm
    Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
    Rogers RO4350B Core: 0.762 mm (30 mil)
    Copper Layer 3: 35 μm


    Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG


    The board dimensions are 42.35 mm x 42.35 mm (± 0.15 mm), with a finished board thickness of 1.7 mm. It supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.3 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers and 0.5 oz (0.7 mils) for the inner layer, with a via plating thickness of 20 μm. The surface finish is ENIG, with a yellow silkscreen on the top and a green solder mask.


    Applications
    The Rogers RO4350B PCB is suitable for a variety of applications, including:


    Cellular base station antennas and power amplifiers
    RF identification tags
    Automotive radar and sensors
    LNBs for direct broadcast satellites


    Availability
    The Rogers RO4350B PCB is available worldwide, designed to meet the demands of modern high-frequency applications. Its advanced material properties and user-friendly processing methods make it an essential choice for engineers and designers.


    Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG

    Quality Rogers RO4350B Rf Pcb Boards 3 Layer 1.7mm ENIG for sale
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