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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
5 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99/PCS |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
Introduction
The Rogers RO4730G3 PCB is a cutting-edge hydrocarbon/ceramic/woven
glass laminate designed specifically for antenna applications. This
UL 94 V-0 rated material serves as a reliable, low-cost alternative
to conventional PTFE-based laminates. The unique resin systems in
RO4730G3 provide the critical properties necessary for optimal
antenna performance. Fully compatible with standard FR-4 and
high-temperature lead-free solder processing, RO4730G3 eliminates
the need for special treatments required for plated through-hole
preparation on traditional PTFE laminates. This affordability
allows designers to optimize both cost and performance effectively.
Features
The RO4730G3 boasts a dielectric constant (Dk) of 3.0 ± 0.05 at 10
GHz, along with a low dissipation factor of 0.0028. Its thermal
coefficient of Dk is 34 ppm/°C, and the material exhibits a
coefficient of thermal expansion (CTE) that is well-matched to
copper, with values of 15.9 ppm/°C (X), 14.4 ppm/°C (Y), and 35.2
ppm/°C (Z). The glass transition temperature (Tg) exceeds 280 °C,
while the decomposition temperature (Td) is 411 °C per TGA.
Additionally, RO4730G3 features a thermal conductivity of 0.45
W/mK, ensuring efficient heat dissipation.
| Property | RO4730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 | X Y Z | ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Benefits
This low-loss dielectric material is designed with a low-profile
foil, leading to reduced passive intermodulation (PIM) and low
insertion loss. The unique closed microsphere filler contributes to
a lightweight construction, making the material approximately 30%
lighter than traditional PTFE/glass laminates. With a low Z-axis
CTE of less than 30 ppm/°C and a high Tg, RO4730G3 offers
significant design flexibility and compatibility with automated
assembly processes.
The low thermal coefficient of dielectric constant (TCDk) of less than 40 ppm/°C ensures consistent circuit performance over a range of temperatures. The specially formulated thermoset resin system provides ease of fabrication and reliable plated through-hole (PTH) processing capability. Additionally, RO4730G3 is environmentally friendly, compatible with lead-free processes, and RoHS compliant.
Technical Specifications
The PCB features a 2-layer rigid stackup, consisting of:
Copper Layer 1: 35 μm
Rogers RO4730G3 Core: 0.762 mm (30 mil)
Copper Layer 2: 35 μm
The board dimensions are 88.2 mm x 66.47 mm (± 0.15 mm), with a finished board thickness of 0.8 mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for the outer layers, and the via plating thickness is 20 μm. The surface finish is Electroless Nickel Immersion Gold (ENIG), with a white silkscreen on the top and a green solder mask.
Applications
The Rogers RO4730G3 PCB is particularly suitable for applications such as cellular base station antennas. Its combination of performance, cost-effectiveness, and ease of processing makes it an ideal choice for engineers and designers in the telecommunications industry.
Availability
The Rogers RO4730G3 PCB is available worldwide, meeting the demands
of modern antenna applications with its advanced properties and
user-friendly processing methods.
| PCB Material: | Hydrocarbon ceramic woven glass |
| Designator: | RO4730G3 |
| Dielectric constant: | 3.0 ±0.05 (process) |
| 2.98 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| Laminate thickness(low profile copper): | 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
| Laminate thickness(ED Copper) | 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP,etc. |
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