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RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

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    Buy cheap RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects from wholesalers
     
    Buy cheap RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects from wholesalers
    • Buy cheap RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects from wholesalers
    • Buy cheap RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects from wholesalers
    • Buy cheap RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects from wholesalers

    RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

    In the rapidly advancing world of electronics, the need for high-performance printed circuit boards (PCBs) is paramount. The RT/duroid 6006 PCB stands out as an exceptional solution for microwave and electronic circuit applications, designed specifically to meet the demands of high-frequency environments. This article delves into the features, specifications, and advantages of the RT/duroid 6006, emphasizing its importance in modern circuit design.


    Material Composition and Characteristics
    The RT/duroid 6006 is a ceramic-PTFE composite that provides outstanding dielectric properties. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz, it enables significant reductions in circuit size while maintaining performance. This high Dk allows engineers to design compact circuits without compromising functionality.


    Key Electrical Properties
    Dissipation Factor: The RT/duroid 6006 boasts a low dissipation factor of 0.0027, ensuring minimal signal loss during operation. This characteristic is crucial for applications that demand high efficiency, particularly in RF and microwave circuits.

    Thermal Stability: With a thermal stability exceeding 500 °C, the RT/duroid 6006 can withstand extreme temperatures, making it suitable for demanding environments. Its thermal coefficient of dielectric constant is -410 ppm/°C, indicating stable performance across a wide temperature range (-50°C to 170°C).

    Moisture Absorption: The PCB exhibits a moisture absorption rate of just 0.05%, enhancing its reliability, especially in humid conditions. This low moisture absorption contributes to the longevity and performance consistency of the circuits.


    PropertyRT/duroid 6006DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess6.15±0.15Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped stripline
    Dielectric Constant,εDesign6.45Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0027Z10 GHz/AIPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-410Zppm/℃-50℃-170℃IPC-TM-650 2.5.5.5
    Volume Resistivity7 x 107Mohm.cmAIPC 2.5.17.1
    Surface Resistivity2 x 107MohmAIPC 2.5.17.1
    Tensile PropertiesASTM D638 (0.1/min. strain rate)
    Young's Modulus627(91) 517(75)X YMPa(kpsi)A
    Ultimate Stress20(2.8) 17(2.5)X YMPa(kpsi)A
    Ultimate Strain12 to 13 4 to 6X Y%A
    Compressive PropertiesASTM D695 (0.05/min. strain rate)
    Young's Modulus1069 (115)ZMPa(kpsi)A
    Ultimate Stress54(7.9)ZMPa(kpsi)A
    Ultimate Strain33Z%
    Flexural Modulus2634 (382) 1951 (283)XMPa(kpsi)AASTM D790
    Ultimate Stress38 (5.5)X YMPa(kpsi)A
    Deformation under load0.33 2.1Z Z%24hr/50℃/7MPa 24hr/150℃/7MPaASTM D261
    Moisture Absorption0.05%D48/50℃ 0.050"(1.27mm) thickIPC-TM-650 2.6.2.1
    Thermal Conductivity0.49W/m/k80℃ASTM C518
    Coefficient of Thermal Expansion47
    34
    117
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.41
    Td500℃ TGAASTM D3850
    Density2.7g/cm3ASTM D792
    Specific Heat0.97(0.231)j/g/k
    (BTU/ib/OF)
    Calculated
    Copper Peel14.3 (2.5)pli (N/mm)after solder floatIPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    Mechanical Properties

    The mechanical characteristics of the RT/duroid 6006 further enhance its applicability:

    Young's Modulus: With values of 627 MPa in the X-direction and 517 MPa in the Y-direction, the material provides robust mechanical strength.

    Ultimate Stress: The ultimate stress values of 20 MPa (X) and 17 MPa (Y) indicate its capacity to withstand significant mechanical loads.

    Coefficient of Thermal Expansion (CTE): The CTE values are 47 ppm/°C (X), 34 ppm/°C (Y), and 117 ppm/°C (Z), ensuring dimensional stability across varying temperatures.


    PCB Construction and Specifications
    This PCB features a well-engineered construction:

    Stackup: 2-layer rigid PCB
    Copper Layer 1: 35 μm
    RT/duroid 6006 Core Thickness: 0.635 mm (25 mil)
    Copper Layer 2: 35 μm
    Dimensions: 65.33 mm x 59.89 mm (±0.15 mm)
    Finished Thickness: 0.7 mm
    Surface Finish: Immersion Silver, enhancing solderability and protecting the copper layers.


    This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.5 mm, providing flexibility in design and manufacturing.


    Advantages of RT/duroid 6006 PCBs
    The RT/duroid 6006 offers a plethora of advantages:

    High Dielectric Constant: Facilitates compact designs without sacrificing performance.
    Low Loss Characteristics: Ideal for high-frequency applications, ensuring reliable signal transmission.
    Reliable Plated Through-Holes: Enhances connectivity and mechanical integrity in multi-layer board designs.


    PCB Material:Ceramic-PTFE Composites
    Designation:RT/duroid 6006
    Dielectric constant:6.15
    Dissipation Factor0.0027 10GHz
    Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

    RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects


    Diverse Applications Across Industries
    The versatility of the RT/duroid 6006 PCB makes it suitable for various applications, including:


    Patch Antennas: Perfect for compact designs in wireless communication.
    Satellite Communications Systems: Provides reliable signal transmission in space applications.
    Power Amplifiers: Enhances performance in RF and microwave circuits.
    Aircraft Collision Avoidance Systems: Critical for safety and reliability in aviation technology.
    Ground Radar Warning Systems: Ensures accurate information in defense applications.


    Quality Assurance and Standards
    Each PCB undergoes rigorous testing, including a 100% electrical test prior to shipment, adhering to IPC-Class-2 standards. This commitment to quality ensures that every unit delivered meets the highest performance criteria.


    Conclusion
    The RT/duroid 6006 PCB represents a significant advancement in PCB technology, offering unmatched performance for high-frequency applications. Its exceptional dielectric properties, mechanical strength, and reliability make it an essential choice for engineers and designers in various industries. By integrating RT/duroid 6006 into your projects, you can maximize performance, reliability, and efficiency, paving the way for innovation in microwave and electronic circuit design. Explore the possibilities with RT/duroid 6006 and elevate your designs to new heights!

    Quality RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects for sale
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