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TMM4 Immersion Gold Pcb For RF And Microwave

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    Buy cheap TMM4 Immersion Gold Pcb For RF And Microwave from wholesalers
     
    Buy cheap TMM4 Immersion Gold Pcb For RF And Microwave from wholesalers
    • Buy cheap TMM4 Immersion Gold Pcb For RF And Microwave from wholesalers
    • Buy cheap TMM4 Immersion Gold Pcb For RF And Microwave from wholesalers
    • Buy cheap TMM4 Immersion Gold Pcb For RF And Microwave from wholesalers

    TMM4 Immersion Gold Pcb For RF And Microwave

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    TMM4 Immersion Gold Pcb For RF And Microwave

    Understanding Rogers TMM4: A Superior Material
    The Rogers TMM4 is a thermoset microwave material that combines the best attributes of both ceramic and traditional PTFE laminates. Designed specifically for high plated-thru-hole reliability in strip-line and micro-strip applications, TMM4 is engineered from a ceramic, hydrocarbon-based polymer composite. This innovative material offers strong mechanical properties and exceptional chemical resistance without the specialized production techniques often required for ceramics and PTFE.


    Key Features of Rogers TMM4 PCB

    1. Dielectric Properties
    The TMM4 PCB exhibits a dielectric constant (Dk) of 4.5 ± 0.045 at 10 GHz, which is essential for effective signal transmission. This characteristic allows for precise control over signal propagation, crucial in high-frequency applications. Additionally, the dielectric constant can reach up to 4.7 in the range of 8 GHz to 40 GHz, making it extremely versatile for various RF applications.


    2. Low Dissipation Factor
    With a dissipation factor (Df) of 0.002 at 10 GHz, the TMM4 PCB minimizes energy loss during signal transmission. This low Df ensures that more power is preserved in the signal, enhancing overall system efficiency.


    3. Thermal Stability
    The TMM4 PCB is capable of withstanding high temperatures, with a decomposition temperature (Td) of 425 °C. This thermal stability is vital for applications that may experience significant thermal stress. The material also features a thermal conductivity of 0.7 W/mK, promoting effective heat dissipation.


    4. Coefficient of Thermal Expansion (CTE)
    The CTE values for the TMM4 PCB are well-matched to copper, with 16 ppm/K in the X and Y axes and 21 ppm/K in the Z-axis. This matching helps prevent warping and delamination, ensuring reliable performance under varying temperature conditions.

    Mechanical and Physical Properties

    5. Mechanical Strength
    The TMM4 PCB possesses strong mechanical properties, including a flexural strength of 15.91 kpsi and a flexural modulus of 1.76 Mpsi. These attributes provide durability and resistance to mechanical stress, essential for maintaining integrity in demanding environments.


    6. Moisture Absorption
    With a moisture absorption rate of 0.07% for 0.050" thickness and 0.18% for 0.125", the TMM4 PCB is highly resistant to environmental changes, which is critical for maintaining performance over time.


    7. Chemical Compatibility
    The TMM4 PCB is compatible with lead-free processes, making it suitable for modern manufacturing standards. Its resistance to process chemicals further reduces the risk of damage during fabrication.


    PropertyTMM4DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess4.5±0.045Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign4.7--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant+15-ppm/°K-55℃-125℃IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity6 x 108-Mohm.cm-ASTM D257
    Surface Resistivity1 x 109-Mohm-ASTM D257
    Electrical Strength(dielectric strength)371ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425℃TGA-ASTM D3850
    Coefficient of Thermal Expansion - x16Xppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y16Yppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z21Zppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.7ZW/m/K80 ℃ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)15.91X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.76X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.07-%D/24/23ASTM D570
    3.18mm (0.125")0.18
    Specific Gravity2.07--AASTM D792
    Specific Heat Capacity0.83-J/g/KACalculated
    Lead-Free Process CompatibleYES----

    PCB Stackup and Construction
    Configuration: 2-layer rigid PCB
    Copper Layer 1: 35 μm
    Rogers TMM4 Core: 0.762 mm (30 mil)
    Copper Layer 2: 35 μm

    Board Dimensions: 192 mm x 115 mm (±0.15 mm)
    Minimum Trace/Space: 5/7 mils
    Minimum Hole Size: 0.5 mm
    Finished Board Thickness: 0.8 mm
    Finished Copper Weight: 1 oz (1.4 mils) for outer layers
    Via Plating Thickness: 20 μm
    Surface Finish: Immersion Gold
    Silkscreen and Solder Mask:
    Top Silkscreen: White
    Bottom Silkscreen: None
    Top Solder Mask: Green
    Bottom Solder Mask: None

    Quality Assurance: 100% electrical testing performed prior to shipment.


    Typical Applications
    The Rogers TMM4 PCB is versatile, making it suitable for a range of applications, including:


    RF and microwave circuitry
    Power amplifiers and combiners
    Filters and couplers
    Satellite communication systems
    Global Positioning Systems (GPS) antennas
    Patch antennas
    Dielectric polarizers and lenses
    Chip testers


    PCB Material:Composite of Ceramic, hydrocarbon and thermoset polymer
    Designator:TMM4
    Dielectric constant:4.5 ±0.045 (process); 4.7 (design)
    Layer count:1 Layer, 2 Layer
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    Laminate thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

    TMM4 Immersion Gold Pcb For RF And Microwave


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