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Brand Name : | Bicheng |
Certification : | UL, ISO9001, IATF16949 |
Price : | USD9.99-99.99/PCS |
Payment Terms : | T/T |
Supply Ability : | 5000PCS per month |
Delivery Time : | 8-9 working days |
Understanding Rogers TMM4: A Superior Material
The Rogers TMM4 is a thermoset microwave material that combines the
best attributes of both ceramic and traditional PTFE laminates.
Designed specifically for high plated-thru-hole reliability in
strip-line and micro-strip applications, TMM4 is engineered from a
ceramic, hydrocarbon-based polymer composite. This innovative
material offers strong mechanical properties and exceptional
chemical resistance without the specialized production techniques
often required for ceramics and PTFE.
Key Features of Rogers TMM4 PCB
1. Dielectric Properties
The TMM4 PCB exhibits a dielectric constant (Dk) of 4.5 ± 0.045 at
10 GHz, which is essential for effective signal transmission. This
characteristic allows for precise control over signal propagation,
crucial in high-frequency applications. Additionally, the
dielectric constant can reach up to 4.7 in the range of 8 GHz to 40
GHz, making it extremely versatile for various RF applications.
2. Low Dissipation Factor
With a dissipation factor (Df) of 0.002 at 10 GHz, the TMM4 PCB
minimizes energy loss during signal transmission. This low Df
ensures that more power is preserved in the signal, enhancing
overall system efficiency.
3. Thermal Stability
The TMM4 PCB is capable of withstanding high temperatures, with a
decomposition temperature (Td) of 425 °C. This thermal stability is
vital for applications that may experience significant thermal
stress. The material also features a thermal conductivity of 0.7
W/mK, promoting effective heat dissipation.
4. Coefficient of Thermal Expansion (CTE)
The CTE values for the TMM4 PCB are well-matched to copper, with 16
ppm/K in the X and Y axes and 21 ppm/K in the Z-axis. This matching
helps prevent warping and delamination, ensuring reliable
performance under varying temperature conditions.
Mechanical and Physical Properties
5. Mechanical Strength
The TMM4 PCB possesses strong mechanical properties, including a
flexural strength of 15.91 kpsi and a flexural modulus of 1.76
Mpsi. These attributes provide durability and resistance to
mechanical stress, essential for maintaining integrity in demanding
environments.
6. Moisture Absorption
With a moisture absorption rate of 0.07% for 0.050" thickness and
0.18% for 0.125", the TMM4 PCB is highly resistant to environmental
changes, which is critical for maintaining performance over time.
7. Chemical Compatibility
The TMM4 PCB is compatible with lead-free processes, making it
suitable for modern manufacturing standards. Its resistance to
process chemicals further reduces the risk of damage during
fabrication.
Property | TMM4 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 4.5±0.045 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 4.7 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | +15 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | 6 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 1 x 109 | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 371 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 16 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 16 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 21 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 15.91 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.76 | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.07 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.18 | |||||
Specific Gravity | 2.07 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.83 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
PCB Stackup and Construction
Configuration: 2-layer rigid PCB
Copper Layer 1: 35 μm
Rogers TMM4 Core: 0.762 mm (30 mil)
Copper Layer 2: 35 μm
Board Dimensions: 192 mm x 115 mm (±0.15 mm)
Minimum Trace/Space: 5/7 mils
Minimum Hole Size: 0.5 mm
Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) for outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Silkscreen and Solder Mask:
Top Silkscreen: White
Bottom Silkscreen: None
Top Solder Mask: Green
Bottom Solder Mask: None
Quality Assurance: 100% electrical testing performed prior to shipment.
Typical Applications
The Rogers TMM4 PCB is versatile, making it suitable for a range of
applications, including:
RF and microwave circuitry
Power amplifiers and combiners
Filters and couplers
Satellite communication systems
Global Positioning Systems (GPS) antennas
Patch antennas
Dielectric polarizers and lenses
Chip testers
PCB Material: | Composite of Ceramic, hydrocarbon and thermoset polymer |
Designator: | TMM4 |
Dielectric constant: | 4.5 ±0.045 (process); 4.7 (design) |
Layer count: | 1 Layer, 2 Layer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP. |
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