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Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

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    Buy cheap Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards from wholesalers
     
    Buy cheap Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards from wholesalers
    • Buy cheap Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards from wholesalers
    • Buy cheap Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards from wholesalers
    • Buy cheap Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards from wholesalers

    Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards

    Rogers RO3006 PCB 25mmil 2-Layer Immersion Gold Circuit Boards

    Introducing our high-performance Rogers RO3006 PCB, designed with advanced ceramic-filled PTFE composite materials that ensure exceptional electrical and mechanical stability. With its consistent dielectric properties, this PCB is engineered to excel in demanding applications across various industries.


    Key Features
    - Material: Rogers RO3006 ceramic-filled PTFE composites
    - Dielectric Constant: 6.15 ± 0.15 at 10 GHz, 23°C
    - Dissipation Factor: 0.002 at 10 GHz, 23°C
    - Thermal Properties: Td > 500°C, Thermal Conductivity of 0.79 W/mK
    - Moisture Absorption: 0.02%
    - Coefficient of Thermal Expansion: X/Y axes: 17 ppm/°C, Z axis: 24 ppm/°C (-55 to 288 °C)


    PropertyRO3006DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess6.15±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign6.5Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.002Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-262Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.27
    0.15
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity105COND AIPC 2.5.17.1
    Tensile Modulus1498
    1293
    X
    Y
    MPa23℃ASTM D 638
    Moisture Absorption0.02%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.86j/g/kCalculated
    Thermal Conductivity0.79W/M/K50℃ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    17
    17
    24
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500℃ TGAASTM D 3850
    Density2.6gm/cm323℃ASTM D 792
    Copper Peel Stength7.1Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    Benefits
    - Uniform Mechanical Properties: Ideal for multi-layer board designs, especially where a range of dielectric constants is required.

    - Low In-Plane Expansion Coefficient: Matches copper expansion, ensuring reliable surface-mounted assemblies, making it perfect for temperature-sensitive applications.

    - Cost-Effective Manufacturing: Our volume manufacturing process allows for economical laminate pricing without compromising quality.


    PCB Specifications

    - Construction:

    - Copper Layer 1: 35 μm
    - Rogers RO3006 Substrate: 25 mil (0.635 mm)
    - Copper Layer 2: 35 μm


    The Rogers RO3006 PCB measures 51.31 mm x 111.92 mm and consists of two pieces, making it versatile for various applications. Manufacturing specifications include a minimum trace/space of 5/4 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.76 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold for enhanced durability.


    The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is green, improving trace visibility. To ensure reliability, each PCB undergoes 100% electrical testing before shipment.


    PCB Material:Ceramic-filled PTFE Composites
    Designation:RO3006
    Dielectric constant:6.15
    Dissipation Factor0.002 10GHz
    Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    Laminate thickness:5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

    Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards


    Artwork and Standards

    - Artwork Provided: Gerber RS-274-X
    - Accepted Standard: IPC-Class-2
    - Availability: Worldwide


    Typical Applications
    Our Rogers RO3006 PCB is ideally suited for:

    - Automotive radar applications
    - Global positioning satellite antennas
    - Cellular telecommunications systems (power amplifiers and antennas)
    - Patch antennas for wireless communications
    - Direct broadcast satellites
    - Datalink on cable systems
    - Remote meter readers
    - Power backplanes


    Elevate your projects with the reliability and performance of the Rogers RO3006 PCB—engineered for excellence in demanding application.

    Product Tags:

    Immersion Gold PCB

      

    25mmil PCB

      

    Rogers RO3006 PCB

      
    Quality Rogers RO3006 PCB 25mmil 2 Layer Immersion Gold Circuit Boards for sale
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