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1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board

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    Buy cheap 1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board from wholesalers
     
    Buy cheap 1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board from wholesalers
    • Buy cheap 1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board from wholesalers
    • Buy cheap 1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board from wholesalers

    1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board

    We are pleased to introduce our newly shipped PCB utilizing RT/duroid 5880 material, specifically designed for high-frequency and broadband applications. Rogers RT/duroid 5880 laminates are PTFE composites reinforced with glass microfibers, offering a low dielectric constant (Dk) and low dielectric loss. The randomly oriented microfibers help maintain uniformity in the dielectric constant, making this material ideal for demanding RF environments.


    Key Features
    - Dielectric Constant: 2.2 with a tight tolerance of ±0.02 at 10 GHz/23°C
    - Dissipation Factor: 0.0009 at 10 GHz
    - Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C
    - Moisture Absorption: Low at 0.02%
    - CTE (Coefficient of Thermal Expansion):
    - X-axis: 31 ppm/°C
    - Y-axis: 48 ppm/°C
    - Z-axis: 237 ppm/°C
    - Isotropic Properties: Ensures consistent performance in all directions


    Benefits
    - Uniform Electrical Properties: Maintains consistent performance over a wide frequency range.
    - Machinability: Easily cut, shaped, and machined to fit specific design needs.
    - Chemical Resistance: Resists solvents and reagents commonly used in etching and plating processes.
    - Moisture Resistance: Suitable for high-moisture environments, ensuring reliability.
    - Established Material: A well-recognized choice for high-frequency applications.
    - Low Electrical Loss: Provides the lowest loss characteristics among reinforced PTFE materials.


    RT/duroid 5880 Typical Value
    PropertyRT/duroid 5880DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess2.20
    2.20±0.02 spec.
    ZN/AC24/23/50
    C24/23/50
    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5
    Dielectric Constant,εDesign2.2ZN/A8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0004
    0.0009
    ZN/AC24/23/50
    C24/23/50
    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5
    Thermal Coefficient of ε-125Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
    Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
    Specific Heat0.96(0.23)N/Aj/g/k
    (cal/g/c)
    N/ACalculated
    Tensile ModulusTest at 23Test at 100N/AMPa(kpsi)AASTM D 638
    1070(156)450(65)X
    860(125)380(55)Y
    Ultimate Stress29(4.2)20(2.9)X
    27(3.9)18(2.6)Y
    Ultimate Strain67.2X%
    4.95.8Y
    Compressive Modulus710(103)500(73)XMPa(kpsi)AASTM D 695
    710(103)500(73)Y
    940(136)670(97)Z
    Ultimate Stress27(3.9)22(3.2)X
    29(5.3)21(3.1)Y
    52(7.5)43(6.3)Z
    Ultimate Strain8.58.4X%
    7.77.8Y
    12.517.6Z
    Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
    Thermal Conductivity0.2ZW/m/k80ASTM C 518
    Coefficient of Thermal Expansion31
    48
    237
    X
    Y
    Z
    ppm/0-100IPC-TM-650 2.4.41
    Td500N/A TGAN/AASTM D 3850
    Density2.2N/Agm/cm3N/AASTM D 792
    Copper Peel31.2(5.5)N/APli(N/mm)1oz(35mm)EDC foil
    after solder float
    IPC-TM-650 2.4.8
    FlammabilityV-0N/AN/AN/AUL 94
    Lead-free Process CompatibleYesN/AN/AN/AN/A

    PCB Stackup

    - Copper Layer 1: 35 μm
    - RT/duroid 5880 Core: 0.254 mm (10 mil)
    - Copper Layer 2: 35 μm
    - RO4450F Prepreg Bondply: 0.101 mm (4 mil)
    - RT/duroid 5880 Core: 0.787 mm (31 mil)
    - Copper Layer 3: 35 μm


    Construction Details
    The PCB dimensions are 274.32 mm x 179.65 mm (± 0.15 mm) with a finished thickness of 1.2 mm. It supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for both inner and outer layers, with a via plating thickness of 20 μm. The surface finish is immersion tin, with no silkscreen or solder masks applied to either side. Each board undergoes 100% electrical testing before shipment to ensure quality.


    1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board


    Compliance and Availability

    The RT/duroid 5880 PCB is designed to meet stringent industry standards, featuring artwork in the Gerber RS-274-X format. It adheres to the IPC-Class-2 quality standard, ensuring reliability and performance in various applications. This product is available for worldwide distribution, making it accessible to customers globally.


    Typical Applications
    - Commercial airline broadband antennas
    - Microstrip and stripline circuits
    - Millimeter wave applications
    - Radar systems
    - Guidance systems
    - Point-to-point digital radio antennas


    Utilize the exceptional properties of the RT/duroid 5880 PCB to enhance performance and reliability in your high-frequency applications, ensuring dependable operation in challenging environments.


    1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board

    Quality 1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board for sale
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