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TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

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    Buy cheap TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG from wholesalers
     
    Buy cheap TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG from wholesalers
    • Buy cheap TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG from wholesalers
    • Buy cheap TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG from wholesalers

    TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

    TC350 PCB is crafted from Rogers TC350 laminates, featuring a unique composition of PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. This combination results in low insertion loss and high thermal conductivity, making the TC350 an excellent choice for high-power applications. Its design ensures superior reliability and reduced operating temperatures, ideal for power amplifier and antenna systems.


    With a dielectric constant (Dk) of 3.5 at 1 MHz, 1.8 GHz, and 10 GHz, the TC350 laminates maintain excellent stability across various temperatures. This stability is crucial for maximizing gain and minimizing bandwidth loss in power amplifiers and antennas. Moreover, it is key for phase and impedance-sensitive devices, such as network transformers and Wilkinson Power Dividers.


    Key features include:
    - Dissipation Factor: 0.0015 at 1 MHz, 0.0018 at 1.8 GHz, and 0.002 at 10 GHz
    - Coefficient of Thermal Expansion (CTE): 7 ppm/°C in the x and y axes, 23 ppm/°C in the z-axis from 50°C to 150°C
    - Low Thermal Coefficient of Dk: -9 ppm/°C from -40°C to 140°C
    - High Thermal Conductivity: 0.72 W/mk
    - Moisture Absorption: 0.05%
    - T260, T288, T300: > 60 minutes


    PropertyUnitsValueTest Merthod
    1. Electrical Properties
    Dielectric Constant (may vary by thickness)
    @1 MHz3.50IPC TM-650 2.5.5.3
    @1.8 GHz3.50RESONANT CAVITY
    @10 GHz3.50IPC TM-650 2.5.5.5
    Dissipation Factor
    @1 MHz0.0015IPC TM-650 2.5.5.3
    @1.8 GHz0.0018RESONANT CAVITY
    @10 GHz0.0020IPC TM-650 2.5.5.5
    Temperature Coefficient of Dielectric
    TC r @ 10 GHz (-40-150°C)ppm/ºC-9IPC TM-650 2.5.5.5
    Volume Resistivity
    C96/35/90MΩ-cm7.4x106IPC TM-650 2.5.17.1
    E24/125MΩ-cm1.4x108
    Surface Resistivity
    C96/35/903.2x107IPC TM-650 2.5.17.1
    E24/1254.3x108IPC TM-650 2.5.17.1
    Electrical StrengthVolts/mil (kV/mm)780 (31)IPC TM-650 2.5.6.2
    Dielectric BreakdownkV40IPC TM-650 2.5.6
    Arc Resistancesec>240IPC TM-650 2.5.1
    2.Thermal Properties
    Decomposition Temperature (Td)
    Initial°C520IPC TM-650 2.4.24.6
    5%°C567IPC TM-650 2.4.24.6
    T260min>60IPC TM-650 2.4.24.1
    T288min>60IPC TM-650 2.4.24.1
    T300min>60IPC TM-650 2.4.24.1
    Thermal Expansion, CTE (x,y) 50-150ºCppm/ºC7, 7IPC TM-650 2.4.41
    Thermal Expansion, CTE (z) 50-150ºCppm/ºC12IPC TM-650 2.4.24
    % z-axis Expansion (50-260ºC)%1.2IPC TM-650 2.4.24
    3. Mechanical Properties
    Peel Strength to Copper (1 oz/35 micron)
    After Thermal Stresslb/in (N/mm)7 (1.2)IPC TM-650 2.4.8
    At Elevated Temperatures (150ºC)lb/in (N/mm)9 (1.6)IPC TM-650 2.4.8.2
    After Process Solutionslb/in (N/mm)7 (1.2)IPC TM-650 2.4.8
    Young’s Moduluskpsi (MPa)IPC TM-650 2.4.18.3
    Flexural Strength (Machine/Cross)kpsi (MPa)14/10 (97/69)IPC TM-650 2.4.4
    Tensile Strength (Machine/Cross)kpsi (MPa)11/8 (76/55)IPC TM-650 2.4.18.3
    Compressive Moduluskpsi (MPa)ASTM D-3410
    Poisson’s RatioASTM D-3039
    4. Physical Properties
    Water Absorption%0.05IPC TM-650 2.6.2.1
    Density, ambient 23ºCg/cm32.30ASTM D792 Method A
    Thermal ConductivityW/mK0.72ASTM D5470
    Specific HeatJ/gK0.90ASTM D5470
    FlammabilityclassV0UL-94
    NASA Outgassing, 125ºC, ≤10- 6 torr
    Total Mass Loss%0.02NASA SP-R-0022A
    Collected Volatiles%0.01NASA SP-R-0022A
    Water Vapor Recovered%0.01NASA SP-R-0022A

    PCB Material:Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
    Designation:TC350
    Dielectric constant:3.5±0.05
    Thermal Conductivity0.72 W/m-K
    Dissipation FactorDf .002@10 GHz
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

    TC350 PCB benefits from reduced junction temperatures and improved reliability, with excellent heat dissipation and management. This leads to enhanced bandwidth utilization and efficiency for amplifiers and antennas, along with superior plated-through hole reliability.


    Constructed as a 2-layer rigid PCB, it features 35 μm of copper on both layers and a core thickness of 0.254 mm (10 mil) of TC350. The board dimensions measure 97.5 mm x 31.7 mm (± 0.15 mm) with a finished thickness of 0.37 mm. It supports minimum trace and space requirements of 5/5 mils and a minimum hole size of 0.2 mm, with no blind vias. The immersion gold surface finish (ENEPIG) enhances solderability.


    This PCB is supplied with artwork in the Gerber RS-274-X format and meets the IPC-Class-2 quality standard. It is available for worldwide, making it accessible to engineers globally.


    Typical applications include power amplifiers, filters, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas sensitive to dielectric drift, and microwave combiners and power dividers. With its advanced thermal management and excellent electrical performance, the TC350 PCB is a reliable choice for modern electronic designs.


    TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG

    Quality TC350 PCB 10mil 2-Layer 1OZ Copper with ENEPIG for sale
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