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RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

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    Buy cheap RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit from wholesalers
     
    Buy cheap RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit from wholesalers
    • Buy cheap RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit from wholesalers
    • Buy cheap RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit from wholesalers

    RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

    The RT/duroid 6035HTC PCB is engineered from high-frequency circuit materials designed specifically for high-power RF and microwave applications. Utilizing ceramic-filled PTFE composites, this PCB is an exceptional choice for demanding environments where thermal management and performance are critical. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, it ensures efficient heat dissipation, making it ideal for high-power applications.


    Key features of the RT/duroid 6035HTC PCB include a dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and 23°C, along with an impressive dissipation factor of 0.0013 at the same frequency and temperature. The material exhibits a thermal coefficient of dielectric constant of -66 ppm/°C and a moisture absorption rate of just 0.06%. Additionally, with a thermal conductivity of 1.44 W/m/K at 80°C, this PCB provides excellent thermal performance, contributing to lower operating temperatures and enhanced reliability in high-power scenarios.


    RT/duroid 6035HTC Typical Value
    PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
    Dissipation Factor0.0013Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
    Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
    Surface Resistivity108AIPC-TM-650, 2.5.17.1
    Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
    Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
    Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
    Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
    Thermal Conductivity1.44W/m/k80℃ASTM C518
    Density2.2gm/cm323℃ASTM D792
    Copper Peel Stength7.9pli20 sec. @288 ℃IPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-Free Process CompatibleYes

    PCB Material:Ceramic-filled PTFE composites
    Designation:RT/duroid 6035HTC
    Dielectric constant:3.50±0.05
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    The construction of this PCB features a 2-layer rigid stackup, comprising 35 μm of copper on both layers and a 0.762 mm (30 mil) core of RT/duroid 6035HTC. Precise board dimensions of 49.23 mm x 55.55 mm (± 0.15 mm) are complemented by a finished board thickness of 0.83 mm and a minimum trace/space of 6/5 mils. With a minimum hole size of 0.6 mm and no blind vias, this PCB is crafted to meet stringent performance specifications. The immersion gold surface finish ensures excellent solderability, while the blue top solder mask enhances visibility during assembly.

    This PCB is compatible with the Gerber RS-274-X artwork format and adheres to the IPC-Class-2 quality standard, ensuring it meets industry expectations. Additionally, it is available for worldwide, making it accessible to engineers globally.


    Typical applications for the RT/duroid 6035HTC PCB include high-power RF and microwave amplifiers, couplers, filters, combiners, and power dividers. With its advanced thermal management capabilities and excellent high-frequency performance, this PCB is an invaluable asset for modern electronic designs demanding reliability and efficiency.


    RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

    Quality RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit for sale
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