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TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

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    Buy cheap TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit from wholesalers
     
    Buy cheap TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit from wholesalers
    • Buy cheap TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit from wholesalers
    • Buy cheap TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit from wholesalers
    • Buy cheap TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit from wholesalers

    TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

    TLX-8 PCB is a specialized printed circuit board made from high-performance PTFE fiberglass laminates, designed for reliability in a wide variety of RF applications. This versatile material is ideal for low layer count microwave designs, providing mechanical reinforcement in severe environments such as space launches, high-temperature engine modules, and maritime applications.


    Key Features
    - Excellent PIM Values: Achieving values lower than -160 dBc for enhanced performance.
    - Mechanical & Thermal Properties: Exceptional resilience in extreme conditions.
    - Low & Stable Dielectric Constant (Dk): Ensures consistent performance.
    - Dimensionally Stable: Maintains integrity under varying conditions.
    - Low Moisture Absorption: Minimizes the risk of performance degradation.
    - UL 94 V0 Rating: Compliant with stringent flammability standards.

    Electrical Properties
    - Dielectric Constant @ 10 GHz: 2.55 ± 0.04
    - Dissipation Factor @ 10 GHz: 0.0018
    - Surface Resistivity: 6.605 x 10^8 Mohm (elevated temp), 3.550 x 10^6 Mohm (humidity)
    - Volume Resistivity: 1.110 x 10^10 Mohm/cm (elevated temp), 1.046 x 10^10 Mohm/cm (humidity)


    TLX-8 TYPICAL VALUES
    PropertyTest MethodUnitValueUnitValue
    DK @10 GHzIPC-650 2.5.5.32.552.55
    Df @1.9 GHzIPC-650 2.5.5.5.10.00120.0012
    Df @10 GHzIPC-650 2.5.5.5.10.00170.0017
    Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
    Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
    Flexural Strength(MD)ASTM D 709psi28,900N/mm2
    Flexural Strength(CD)ASTM D 709psi20,600N/mm2
    Tensile Strength(MD)ASTM D 902psi35,600N/mm2
    Tensile Strength(CD)ASTM D 902psi27,500N/mm2
    Elongation at Break(MD)ASTM D 902%3.94%3.94
    Elongation at Break(CD)ASTM D 902%3.92%3.92
    Young's Modulus(MD)ASTM D 902kpsi980N/mm2
    Young's Modulus(CD)ASTM D 902kpsi1,200N/mm2
    Young's Modulus(MD)ASTM D 3039kpsi1,630N/mm2
    Poisson's RatioASTM D 30390.135N/mm
    Peel Stength(1 oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch15N/mm
    Peel Stength(1 oz.RTF)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch17N/mm
    Peel Stength(½ oz.ed)IPC-650 2.4.8.3(Elevated Temp.)Ibs./linear inch14N/mm
    Peel Stength(½ oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch11N/mm
    Peel Stength(1 oz.rolled)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch13N/mm2.1
    Thermal ConductivityASTM F433/ASTM 1530-06W/M*K0.19W/M*K0.19
    Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(After Bake.)mils/in.0.06mm/M
    Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.4(After Bake.)mils/in.0.08mm/M
    Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.09mm/M
    Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.1mm/M
    Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm6.605 x 108Mohm6.605 x 108
    Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm3.550 x 106Mohm3.550 x 106
    Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm/cm1.110 x 1010Mohm/cm1.110 x 1010
    Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm/cm1.046 x 1010Mohm/cm1.046 x 1010
    CTE(X axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/21ppm/21
    CTE(Y axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/23ppm/23
    CTE(Z axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/215ppm/215
    Density(Specific Gravity)ASTM D 792g/cm32.25g/cm32.25
    Td(2% Weight Loss)IPC-650 2.4.24.6(TGA)535
    Td(5% Weight Loss)IPC-650 2.4.24.6(TGA)553
    Flammability RatingUL-94V-0V-0

    TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit


    The construction of this PCB includes a 2-layer rigid stackup, featuring 35 μm copper layers on both sides and a 1.27 mm (50 mil) Taconic TLX-8 core. The board dimensions are 130 mm x 75 mm (± 0.15 mm), with a finished thickness of 1.3 mm. It supports minimum trace and space requirements of 7/6 mils and a minimum hole size of 0.35 mm. Each board is finished with an immersion gold surface finish and a green top solder mask, with 100% electrical testing conducted prior to shipment to ensure reliability.


    It is supplied with artwork in the Gerber RS-274-X format and complies with IPC-Class-2 quality standards. This PCB is available for worldwide, making it accessible to engineers globally.


    Typical applications for TLX-8 PCB include radar systems, mobile communications, microwave test equipment, microwave transmission devices, and various coupling, splitting, combining, amplifying, and antenna solutions. With its advanced features and reliable performance, the TLX-8 PCB is an excellent choice for modern RF and microwave applications.


    TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit

    Quality TLX-8 PCB 50mil Double-Layer Immersion Gold 1OZ RF Circuit for sale
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