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Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

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    Buy cheap Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled from wholesalers
     
    Buy cheap Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled from wholesalers
    • Buy cheap Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled from wholesalers
    • Buy cheap Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled from wholesalers
    • Buy cheap Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled from wholesalers

    Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

    We are excited to announce our newly shipped 6-layer printed circuit board (PCB) designed with Rogers RO4003C materials. This innovative PCB combines exceptional electrical performance with manufacturing ease, making it a perfect solution for high-frequency applications.


    Key Features

    RO4003C Material

    - Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
    - Dissipation Factor: 0.0027 at 10 GHz
    - Thermal Conductivity: 0.71 W/m/°K
    - Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
    - CTE Matched to Copper:
    - X axis: 11 ppm/°C
    - Y axis: 14 ppm/°C
    - Z-axis CTE: 46 ppm/°C
    - Glass Transition Temperature (Tg): >280 °C
    - Moisture Absorption: 0.06%
    - Non-Brominated


    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes

    S1000-2M Features

    - Enhanced Z-axis CTE for improved through-hole reliability
    - Excellent mechanical processability and thermal resistance
    - Lead-free compatibility
    - Tg: 180°C (DSC)
    - UV blocking and AOI compatible
    - High heat resistance with superior anti-CAF performance
    - Low water absorption


    PCB Specifications

    - Layer Stackup:
    - Copper Layer 1: 35 μm
    - RO4003C Core: 0.305 mm (12 mil)
    - Copper Layer 2: 35 μm
    - Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
    - Copper Layer 3: 35 μm
    - FR-4 (Tg 170): 0.076 - 0.203 mm (3 mil)
    - Copper Layer 4: 35 μm
    - Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
    - Copper Layer 5: 35 μm
    - RO4003C Core: 0.305 mm (12 mil)
    - Copper Layer 6: 35 μm


    - Dimensions: 83.50 mm x 66 mm ± 0.15 mm
    - Finished Board Thickness: 1.1 mm
    - Finished Copper Weight: 1 oz (1.4 mils) on both inner and outer layers
    -Minimum Trace/Space: 4/4 mils
    - Minimum Hole Size: 0.2 mm
    - Via Plating Thickness: 20 μm
    - Surface Finish: Immersion Gold
    - Solder Mask Color: Matt Green (top and bottom)
    - Silkscreen Color: White (top only)
    - Impedance Control: 50 ohm on 4 mil / 4 mil traces/gaps (top layer)
    - Via Configuration: 0.2 mm via filled and capped
    - Electrical Testing: 100% before shipment


    Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled


    Typical Applications

    This PCB is ideal for a variety of advanced applications, including:


    - Commercial airline broadband antennas
    - Microstrip and stripline circuits
    - Millimeter wave applications
    - Radar systems
    - Guidance systems
    - Point-to-point digital radio antennas


    Quality Assurance

    Manufactured to IPC-Class 2 standards, our PCB ensures high reliability and performance. The artwork is supplied in Gerber RS-274-X format, compatible with most PCB design tools.


    Global Availability

    Our high-performance PCB is available for worldwide shipping, providing cutting-edge solutions wherever you are located.


    Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

    Quality Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled for sale
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