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3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

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    Buy cheap 3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit from wholesalers
     
    Buy cheap 3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit from wholesalers
    • Buy cheap 3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit from wholesalers

    3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

    Introducing our newly shipped hybrid printed circuit board (PCB), designed for high-frequency applications with unmatched performance and reliability. This advanced PCB combines Rogers’ RO3210 and RO3003 materials, providing a unique blend of mechanical stability and excellent electrical characteristics, making it ideal for a wide range of demanding applications.


    Key Features


    RO3210 Material
    - Dielectric Constant (Dk): 10.2 ± 0.5
    - Dissipation Factor: 0.0027 at 10 GHz
    - Thermal Stability:
    - Coefficient of Thermal Expansion (CTE):
    - X & Y axes: 13 ppm/°C
    - Z axis: 34 ppm/°C
    - Decomposition Temperature (Td): 500 °C
    - Thermal Conductivity: 0.81 W/mK
    - Flammability Rating: V0 (UL 94 standard)


    RO3210 Typical Value
    PropertyRO3210DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess10.2±0.5Z10 GHz 23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign10.8Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0027Z10 GHz 23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-459Zppm/℃10 GHz 0℃to 100℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.8X, Ymm/mCOND AASTM D257
    Volume Resistivity103MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity103COND AIPC 2.5.17.1
    Tensile Modulus579
    517
    MD
    CMD
    kpsi23℃ASTM D 638
    Water Absorption<0.1-%D24/23IPC-TM-650 2.6.2.1
    Specific Heat0.79j/g/kCalculated
    Thermal Conductivity0.81W/M/K80℃ASTM C518
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    13
    34

    X,Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500TGAASTM D3850
    Density3gm/cm3
    Copper Peel Stength11pli1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    RO3003 Material
    - Dielectric Constant (Dk): 3 ± 0.04 at 10 GHz/23°C
    - Dissipation Factor: 0.001 at 10 GHz/23°C
    - Thermal Stability:
    - Td: > 500 °C
    - Coefficient of Thermal Expansion:
    - X axis: 17 ppm/°C
    - Y axis: 16 ppm/°C
    - Z axis: 25 ppm/°C
    - Moisture Absorption: 0.04%
    - Thermal Conductivity: 0.5 W/mK


    RO3003 Typical Value
    PropertyRO3003DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.0±0.04Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.001Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-3Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
    Dimensional Stability0.06
    0.07
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus930
    823
    X
    Y
    MPa23ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.9j/g/kCalculated
    Thermal Conductivity0.5W/M/K50ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288
    )
    17
    16
    25
    X
    Y
    Z
    ppm/23/50% RHIPC-TM-650 2.4.4.1
    Td500 TGAASTM D 3850
    Density2.1gm/cm323ASTM D 792
    Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    PCB Specifications

    - Stackup: 3-layer rigid PCB

    - Copper Layer 1: 35 μm
    - Rogers RO3003 Core: 1.524 mm (60 mil)
    - RO4450F Bondply: 0.101 mm (4 mil)
    - Rogers RO3210 Core: 1.27 mm (50 mil)
    - Copper Layer 1: 35 μm


    - Dimensions: 62.8 mm x 62.8 mm ± 0.15 mm
    - Finished Board Thickness: 3.0 mm
    - Finished Copper Weight: 1 oz (1.4 mils) on outer layers
    - Minimum Trace/Space: 7/9 mils
    - Minimum Hole Size: 0.4 mm
    - Via Plating Thickness: 20 μm
    - Surface Finish: Immersion Tin
    - Electrical Testing: 100% electrical test prior to shipment


    3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit


    Application Areas

    This hybrid PCB is tailored for various high-performance applications, including:


    - Automotive Technologies: Collision avoidance systems and global positioning satellite antennas
    - Telecommunications: Wireless systems, microstrip patch antennas, and direct broadcast satellites
    - Remote Monitoring: Datalink on cable systems and remote meter readers
    - Infrastructure Solutions: Power backplanes, LMDS, wireless broadband, and base station infrastructure


    Quality Assurance

    Manufactured to IPC-Class 2 standards, this PCB ensures high reliability and performance. The artwork is provided in Gerber RS-274-X format, making it compatible with standard PCB design tools.


    Global Availability

    Our hybrid PCB is available for worldwide shipping, allowing you to leverage cutting-edge technology in your projects, no matter your location.


    3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

    Quality 3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit for sale
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