Sign In | Join Free | My himfr.com
himfr.com

Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Verified Supplier

5 Years

Home > RF PCB Board >

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap 4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold from wholesalers
     
    Buy cheap 4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold from wholesalers
    • Buy cheap 4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold from wholesalers

    4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

    Introducing our newly shipped 4-layer printed circuit board (PCB) engineered with high-performance materials—Rogers RT/duroid 5880 and RO4003C. This PCB is designed for high-frequency and broadband applications, offering exceptional electrical properties and reliability.


    Material Introductions


    RT/duroid 5880
    Rogers RT/duroid 5880 is a high-frequency laminate made from PTFE composites reinforced with glass microfibers. This material features:
    - Low Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz
    - Low Loss: Dissipation factor of 0.0009 at 10 GHz
    - Uniformity: Randomly oriented microfibers enhance Dk stability.


    RT/duroid 5880 Typical Value
    PropertyRT/duroid 5880DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess2.20
    2.20±0.02 spec.
    ZN/AC24/23/50
    C24/23/50
    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5
    Dielectric Constant,εDesign2.2ZN/A8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0004
    0.0009
    ZN/AC24/23/50
    C24/23/50
    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5
    Thermal Coefficient of ε-125Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
    Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
    Specific Heat0.96(0.23)N/Aj/g/k
    (cal/g/c)
    N/ACalculated
    Tensile ModulusTest at 23Test at 100N/AMPa(kpsi)AASTM D 638
    1070(156)450(65)X
    860(125)380(55)Y
    Ultimate Stress29(4.2)20(2.9)X
    27(3.9)18(2.6)Y
    Ultimate Strain67.2X%
    4.95.8Y
    Compressive Modulus710(103)500(73)XMPa(kpsi)AASTM D 695
    710(103)500(73)Y
    940(136)670(97)Z
    Ultimate Stress27(3.9)22(3.2)X
    29(5.3)21(3.1)Y
    52(7.5)43(6.3)Z
    Ultimate Strain8.58.4X%
    7.77.8Y
    12.517.6Z
    Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
    Thermal Conductivity0.2ZW/m/k80ASTM C 518
    Coefficient of Thermal Expansion31
    48
    237
    X
    Y
    Z
    ppm/0-100IPC-TM-650 2.4.41
    Td500N/A TGAN/AASTM D 3850
    Density2.2N/Agm/cm3N/AASTM D 792
    Copper Peel31.2(5.5)N/APli(N/mm)1oz(35mm)EDC foil
    after solder float
    IPC-TM-650 2.4.8
    FlammabilityV-0N/AN/AN/AUL 94
    Lead-free Process CompatibleYesN/AN/AN/AN/A

    RO4003C
    Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that combines:
    - Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
    - Cost-Effectiveness: Utilizes standard epoxy/glass processing methods.
    - Low Moisture Absorption: 0.06%, enhancing reliability.



    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes

    4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold


    PCB Specifications

    Stackup:


    Copper Layer 1: 35 μm

    RT/duroid 5880: 0.787 mm (31 mil)

    Copper Layer 2: 35 μm

    RO4450F Prepreg Bondply: 0.101 mm (4 mil)

    Copper Layer 3: 35 μm

    RO4003C: 0.203 mm (8 mil)

    Copper Layer 4: 35 μm


    This PCB measures 110 mm x 51 mm ± 0.15 mm, with a finished thickness of 1.3 mm and a copper weight of 1 oz (1.4 mils) on both inner and outer layers. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3 mm, with a via plating thickness of 20 μm.

    For surface finish, it uses immersion gold, complemented by a green solder mask on the top side and no mask on the bottom. A white silkscreen is applied on the top for clear component labeling. Each PCB is 100% electrically tested before shipment to ensure high quality and reliability.


    Typical Applications

    - Commercial Airline Broadband Antennas
    - Microstrip and Stripline Circuits
    - Millimeter Wave Applications
    - Radar Systems
    - Guidance Systems
    - Point-to-Point Digital Radio Antennas


    Quality Assurance

    This PCB meets IPC-Class 2 standards and is supplied with Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software.


    Global Availability

    Available for worldwide shipping, our advanced PCB technology is ready to support your high-frequency application needs.


    4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

    Quality 4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)