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Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board

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    Buy cheap Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board from wholesalers
     
    Buy cheap Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board from wholesalers
    • Buy cheap Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board from wholesalers
    • Buy cheap Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board from wholesalers

    Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board

    Introducing the Rogers RO4350B PCB, a state-of-the-art solution designed for high-frequency applications. Made from proprietary woven glass reinforced hydrocarbon/ceramics, RO4350B offers electrical performance comparable to PTFE/woven glass while maintaining the manufacturability advantages of epoxy/glass composites. This material is engineered to provide tight control over dielectric constant (Dk) and low loss, all at a fraction of the cost of conventional microwave laminates.


    RO4350B laminates do not require special through-hole treatments or handling procedures, making them easier to work with than PTFE-based materials. Rated UL 94 V-0, they are ideal for active devices and high-power RF designs, ensuring reliability and performance.


    Key Features
    1. Dielectric Constant: 3.48 ± 0.05 at 10 GHz/23°C, ensuring reliable signal integrity for RF applications.


    2. Dissipation Factor: Low at 0.0037 at 10 GHz/23°C, minimizing signal loss.


    3. Thermal Conductivity: 0.69 W/m/°K, facilitating effective heat management.

    4. Thermal Coefficient of Expansion (CTE): X axis at 10 ppm/°C, Y axis at 12 ppm/°C, and Z axis at 32 ppm/°C, providing excellent dimensional stability.


    5. High Tg Value: Greater than 280 °C, ensuring stability during thermal processing.


    6. Water Absorption: Low at 0.06%, enhancing reliability in various environments.


    RO4350B Typical Value
    PropertyRO4350BDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0037
    0.0031
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus16,767(2,432)
    14,153(2,053)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength203(29.5)
    130(18.9)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength255
    (37)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.5X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion10
    12
    32
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td390℃ TGAASTM D 3850
    Thermal Conductivity0.69W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.86gm/cm323℃ASTM D 792
    Copper Peel Stength0.88
    (5.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    Flammability(3)V-0UL 94
    Lead-free Process CompatibleYes

    Benefits
    1. Multi-Layer Board Compatibility: Ideal for MLB constructions, ensuring excellent dimensional stability.


    2. Cost-Efficient Processing: Processes like FR-4, resulting in lower fabrication costs.


    3. Reliable Thermal Performance: Low Z-axis CTE provides consistent plated through-hole quality, even under thermal stress.


    PCB Specifications
    This PCB is designed as a 2-layer rigid board with dimensions measuring 45 mm x 66 mm, with a tolerance of ±0.15 mm. It features two copper layers, each with a thickness of 35 μm, sandwiching a core of Rogers RO4350B material that is 0.168 mm (6.6 mil) thick. The finished board thickness is 0.25 mm, and the outer layers have a copper weight of 1 oz (1.4 mils).


    The via plating is set at a thickness of 20 μm, and the surface finish is achieved through immersion silver. Notably, the board does not include silkscreen or solder mask on either side. Prior to shipment, each PCB undergoes a rigorous 100% electrical testing process to ensure reliability and performance.


    Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board


    Artwork and Standards
    The Rogers RO4350B PCB comes with Gerber RS-274-X artwork and meets IPC-Class-2 quality standards, ensuring reliability and performance in demanding applications.


    Availability
    Our Rogers RO4350B PCBs are available for worldwide shipping, making it easy for engineers and designers to access this advanced technology for their projects.


    Typical Applications
    The Rogers RO4350B PCB is ideal for a wide range of applications, including:


    -Cellular base station antennas and power amplifiers

    -RF identification tags

    -Automotive radar systems and sensors

    -LNBs for direct broadcast satellites


    Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board

    Quality Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board for sale
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