Sign In | Join Free | My himfr.com
himfr.com

Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Verified Supplier

5 Years

Home > RF PCB Board >

RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver from wholesalers
     
    Buy cheap RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver from wholesalers
    • Buy cheap RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver from wholesalers
    • Buy cheap RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver from wholesalers

    RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver

    The Rogers RO4003C PCB is an innovative solution that combines the benefits of woven glass reinforced hydrocarbon/ceramics with the manufacturing advantages of epoxy/glass. Engineered for high-performance applications, this laminate offers electrical properties comparable to PTFE/woven glass while remaining cost-effective. With a variety of configurations available, RO4003C ensures tight control over dielectric constant and low loss, making it an excellent choice for multi-layer board (MLB) constructions.


    Features
    - Dielectric Constant: 3.38 ± 0.05 at 10 GHz, providing reliable signal integrity.

    - Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss.

    - Thermal Conductivity: 0.71 W/m/°K for effective heat management.

    - Thermal Stability: Coefficient of dielectric constant at +40 ppm/°C, with operational range from -50°C to 150°C.

    - Coefficient of Thermal Expansion (CTE): Matched to copper with X axis at 11 ppm/°C and Y axis at 14 ppm/°C; low Z-axis CTE of 46 ppm/°C.

    - Glass Transition Temperature (Tg): Greater than 280 °C, providing robust thermal performance.

    - Moisture Absorption: Low at 0.06%, enhancing reliability.


    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23
    2.5 GHz/23
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/-55to288IPC-TM-650 2.4.41
    Tg>280 TMAAIPC-TM-650 2.4.24.3
    Td425 TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50
    ASTM D 570
    Density1.79gm/cm323ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes

    Benefits
    The Rogers RO4003C PCB is ideal for performance-sensitive, high-volume applications. It is processed similarly to standard FR-4 materials, allowing for lower fabrication costs without compromising quality. The design does not require special handling procedures, making it accessible for various manufacturing environments.


    PCB Specifications

    This PCB is constructed as a 2-layer rigid board with dimensions of 90.63 mm x 170.35 mm, with a tolerance of ±0.15 mm. The stackup includes a 0.406 mm (16 mil) Rogers 4003C core sandwiched between two 35 μm copper layers. The finished board thickness is 0.5 mm, with a copper weight of 1 oz (1.4 mils) on the outer layers. The board features a green solder mask on the top and a white silkscreen, ensuring clarity in design.


    RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver


    Artwork and Standards

    This PCB is supplied with artwork in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This compliance guarantees that the PCB meets stringent requirements for performance and reliability.


    Availability

    This RO4003C PCB is available for worldwide shipping, making it easy for engineers and designers to access cutting-edge technology for their projects, regardless of location.


    Typical Applications

    This PCB is particularly suitable for:


    -Cellular base station antennas and power amplifiers

    -RF identification tags

    -Automotive radar and sensor systems

    -LNBs for direct broadcast satellites

    -Elevate your electronic designs with the Rogers RO4003C PCB—an exceptional choice for high-performance applications that require reliability, efficiency, and cost-effectiveness.


    RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver

    Quality RO4003C PCB 16mil 2-Layer Circuit Board with Immersion Silver for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)