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25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

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    Buy cheap 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished from wholesalers
     
    Buy cheap 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished from wholesalers
    • Buy cheap 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished from wholesalers
    • Buy cheap 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished from wholesalers
    • Buy cheap 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished from wholesalers

    25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

    RF-10 PCBs are advanced composites of ceramic-filled PTFE and woven fiberglass, designed for high-performance RF applications. Offering a high dielectric constant and low dissipation factor, RF-10 provides exceptional dimensional stability and ease of handling for multilayer circuits.


    Key Features:

    Dielectric Constant: 10.2 ± 0.3 at 10GHz
    Dissipation Factor: 0.0025 at 10GHz
    High Thermal Conductivity: 0.85 W/mk (Unclad)
    CTE: x 16 ppm/°C, y 20 ppm/°C, z 25 ppm/°C
    Low Moisture Absorption: 0.08%
    Flammability Rating: V-0

    Benefits:

    High DK for RF circuit size reduction
    Excellent dimensional stability
    Tight DK tolerance
    High thermal conductivity for enhanced thermal management
    Strong adhesion to smooth coppers
    Low X, Y, Z expansion
    Excellent price/performance ratio


    RF-10 Typical Values
    PropertyTest MethodUnitValueUnitValue
    Dk @ 10 GHzIPC-650 2.5.5.5.1 Mod.10.2 ± 0.310.2 ± 0.3
    Df @ 10 GHzIPC-650 2.5.5.5.1 Mod.0.00250.0025
    TcK† (-55 to 150 °C)IPC-650 2.5.5.6ppm/°C-370ppm/°C-370
    Moisture AbsorptionIPC-650 2.6.2.1%0.08%0.08
    Peel Strength (1 oz. RT copper)IPC-650 2.4.8 (solder)lbs/in10N/mm1.7
    Volume ResistivityIPC-650 2.5.17.1Mohm/cm6.0 x 107Mohm/cm6.0 x 107
    Surface ResistivityIPC-650 2.5.17.1Mohm1.0 x 108Mohm1.0 x 108
    Flexural Strength (MD)IPC - 650 - 2.4.4psi14,000N/mm296.53
    Flexural Strength (CD)IPC - 650 - 2.4.4psi10,000N/mm268.95
    Tensile Strength (MD)IPC - 650 - 2.4.19psi8,900N/mm262.57
    Tensile Strength (CD)IPC - 650 - 2.4.19psi5,300N/mm237.26
    Dimensional StabilityIPC-650 2.4.39 (After Etch)% (25 mil-MD)-0.0032% (25 mil-CD)-0.0239
    Dimensional StabilityIPC-650 2.4.39 (After Bake)% (25 mil-MD)-0.0215% (25 mil-CD)-0.0529
    Dimensional StabilityIPC-650 2.4.39 (After Stress)% (25 mil-MD)-0.0301% (25 mil-CD)-0.0653
    Dimensional StabilityIPC-650 2.4.39 (After Etch)% (60 mil-MD)-0.0027% (60 mil-CD)-0.0142
    Dimensional StabilityIPC-650 2.4.39 (After Bake)% (60 mil-MD)-0.1500% (60 mil-CD)-0.0326
    Dimensional StabilityIPC-650 2.4.39 (After Stress)% (60 mil-MD)-0.0167% (60 mil-CD)-0.0377
    Density (Specific Gravity)IPC-650-2.3.5g/cm32.77g/cm32.77
    Specific HeatIPC-650-2.4.50J/g°C0.9J/g°C0.9
    Thermal Conductivity (Unclad)IPC-650-2.4.50W/M*K0.85W/M*K0.85
    CTE (X -Y axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C16-20ppm/°C16-20
    CTE (Z axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C25ppm/°C25
    Flammability RatingInternalV-0V-0


    This PCB features a precise stackup configuration comprising Copper_layer_1 and Copper_layer_2 each measuring 35μm (1oz) in thickness, sandwiching the RF-10 Core layer at 25 mil (0.635mm). With a board size of 163.9mm x 104.9mm ± 0.15mm, the PCB maintains a minimum trace/space of 4/4 mils for optimal signal integrity and component spacing.


    Mechanically, this PCB offers a minimum hole size of 0.5mm and a finished board thickness of 0.75mm, ensuring structural stability and flexibility during installation. The copper weight of 1oz (1.4 mils) on the outer layers, along with a 20 μm via plating thickness, supports efficient signal transmission and secure interconnections between layers.


    It is finished with Immersion Tin for enhanced solderability and protection against oxidation. A white top silkscreen aids in component identification, while a green top solder mask provides environmental protection. Rigorous 100% electrical testing before shipment guarantees quality and adherence to design specifications, ensuring reliable performance in diverse applications.


    25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished


    The artwork format for this PCB follows the industry-standard Gerber RS-274-X format, ensuring compatibility with common design tools and manufacturing processes. Adhering to the IPC-Class-2 quality standard, the PCB meets stringent criteria for manufacturing and assembly, guaranteeing reliable performance in various applications.


    With availability worldwide, the RF-10 PCB offers global accessibility for projects and industries requiring high-performance RF solutions.


    Applications:

    Microstrip Patch Antennas
    GPS Antennas
    Passive Components (filters, couplers, power dividers)
    Aircraft Collision Avoidance Systems
    Satellite Components


    PCB Material:Composites of Ceramic Filled PTFE and Woven Fiberglass
    Designation:RF-10
    Dielectric constant:10.2
    Dissipation Factor0.0025 10GHz
    Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
    Quality 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished for sale
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