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Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

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    Buy cheap Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin from wholesalers
     
    Buy cheap Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin from wholesalers
    • Buy cheap Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin from wholesalers
    • Buy cheap Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin from wholesalers
    • Buy cheap Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin from wholesalers
    • Buy cheap Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin from wholesalers

    Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin

    The Rogers RO3203 PCB represents the latest advancement in high-frequency circuit materials, specifically engineered for exceptional electrical performance and mechanical stability. Constructed from ceramic-filled laminates reinforced with woven fiberglass, the RO3203 builds upon the legacy of the RO3000 Series, distinguished by its improved mechanical stability. With a dielectric constant of 3.02 and a low dissipation factor of 0.0016, this material extends the operational frequency range beyond 40 GHz, making it an ideal choice for a variety of demanding applications.


    Key Features
    The Rogers RO3203 PCB is designed with several standout features that enhance its performance and usability:


    High-Frequency Performance: The dielectric constant of 3.02 ± 0.04 at 10 GHz ensures reliable signal integrity.


    Low Dissipation Factor: With a dissipation factor of 0.0016 at 10 GHz, it minimizes energy losses, supporting high-frequency applications.


    Thermal Stability: The material can withstand temperatures above 500°C, making it suitable for a wide range of environments.


    Thermal Conductivity: At 0.87 W/mK, it effectively manages heat dissipation, which is crucial for high-performance circuits.


    Coefficient of Thermal Expansion: The low CTE (X: 13 ppm/°C, Y: 13 ppm/°C, Z: 58 ppm/°C) matched to copper ensures reliable performance in epoxy multi-layer board hybrid designs.


    Lead-Free Process Compatibility: Compliant with environmental standards, including a 94V-0 flammability rating, making it suitable for modern manufacturing processes.


    PropertyRO3203DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.02±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Dissipation Factor,tanδ0.0016Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Conductivity0.47 (3.2)W/mKFloat 100℃ASTM C518
    Volume Resistivity107MΩ.cmAASTM D257
    Surface Resistivity107AASTM D257
    Dimensional Stability0.08X, Ymm/m +E2/150after etchIPC-TM-650 2.4.3.9
    Tensile ModulusX YkpsiRTASTM D638
    Flexural Modulus400 300X YkpsiAASTM D790
    Tensile Strength12.5 13X YkpsiRTASTM D638
    Flexural Strength9 8X YkpsiAASTM D790
    Moisure Absorption<0.1%D24/23IPC-TM-650 2.6.2.1
    Coefficient of Thermal Expansion58 13Z X,Yppm/℃-50 ℃to 288℃ASTM D3386
    Td500TGAASTM D3850
    Density2.1gm/cm323℃ASTM D792
    Copper Peel Stength10 (1.74)lbs/in (N/mm)After solderIPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-Free Process CompatibleYes

    Benefits
    The RO3203 PCB offers numerous advantages that make it ideal for high-frequency applications:


    Improved Rigidity: The woven glass reinforcement enhances rigidity, facilitating easier handling during assembly and manufacturing.


    Uniform Performance: It provides consistent electrical and mechanical performance, making it perfect for complex multi-layer structures.


    Low Dielectric Loss: This feature supports high-frequency applications exceeding 20 GHz, ensuring optimal signal transmission.


    Excellent Dimensional Stability: High production yields are achievable due to its stability, making it a reliable choice for large-scale manufacturing.


    Cost-Effective: The RO3203 is competitively priced, making it an economical option for volume manufacturing.


    Technical Specifications


    The Rogers RO3203 PCB features a 2-layer rigid stackup, designed for optimal performance:


    Copper Layer 1: 35 μm

    RO3203 Substrate: 20 mil (0.508 mm)

    Copper Layer 2: 35 μm


    The finished board dimensions are 65.78 mm x 37.48 mm, with a total thickness of 0.6 mm. It supports minimum trace and space of 5/5 mils and has a minimum hole size of 0.4 mm. The finished copper weight on the outer layers is 1 oz (1.4 mils), and the surface finish is immersion tin. Each board undergoes 100% electrical testing prior to shipment to ensure quality and reliability.


    The Rogers RO3203 PCB is suitable for a wide range of applications, including automotive collision avoidance systems, GPS antennas, wireless telecommunications systems, microstrip patch antennas, direct broadcast satellites, data links in cable systems, remote meter readers, and power backplanes. Its versatility and high performance make it an invaluable asset in various industries, including automotive and telecommunications.


    For more information or to place an order, please contact our sales team or visit our website. Experience the reliability and efficiency of the Rogers RO3203 PCB in your next project.


    Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin


    PCB Material:Ceramic-filled Laminates Reinforced with Woven Fiberglass
    Designation:RO3203
    Dielectric constant:3.02±0.04
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..
    Quality Rogers RO3203 PCB 20mil Green Soldermask Immersion Tin for sale
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