The Rogers RO3010 PCB is a state-of-the-art printed circuit board made from advanced ceramic-filled PTFE composites. Engineered for high-performance applications, it offers a high dielectric constant and exceptional stability, making it suitable for a diverse range of electronic designs. The RO3010 simplifies the creation of broadband components and supports circuit miniaturization, making it an ideal choice for engineers focused on precision and reliability.

Key Features
High Dielectric Constant: 10.2 ± 0.30 at 10 GHz/23°C, ensuring superior signal integrity.

Low Dissipation Factor: 0.0022 at 10 GHz/23°C, minimizing energy loss and enhancing system efficiency.

Thermal Stability:
Coefficient of Thermal Expansion (CTE):

X: 13 ppm/°C
Y: 11 ppm/°C
Z: 16 ppm/°C

Operating temperature range: -40°C to +85°C.

Thermal Decomposition Temperature (Td): Greater than 500°C, providing durability under extreme conditions.

Thermal Conductivity: 0.95 W/mK, facilitating effective heat management.

Moisture Absorption: Only 0.05%, ensuring reliability in diverse environments.

Benefits
Dimensional Stability: With an expansion coefficient closely matched to copper, the RO3010 ensures reliability during thermal cycling.

Cost-Effective Manufacturing: Economical laminate pricing makes it suitable for high-volume production without compromising quality.

Versatile Design Options: Ideal for multi-layer board designs, accommodating complex circuit layouts.

Technical Specifications

PCB Stackup: 3-layer rigid PCB

Copper Layer 1: 35 μm
RO3010 Core: 50 mil (1.27 mm)
Copper Layer 2: 35 μm
Prepreg: 0.1 mm
RO3010 Core: 50 mil (1.27 mm)
Copper Layer 3: 35 μm

The finished board dimensions are 30 mm x 25 mm, with a total thickness of 2.7 mm. It supports minimum trace and space of 5/5 mils and has a minimum hole size of 0.5 mm. The finished copper weight on the outer layers is 1 oz (1.4 mils), and the surface finish is immersion tin. Each PCB undergoes 100% electrical testing prior to shipment, ensuring quality and reliability.

The Rogers RO3010 PCB is ideal for a variety of applications, including automotive radar, GPS antennas, cellular telecommunications systems, patch antennas for wireless communications, direct broadcast satellites, data links in cable systems, remote meter readers, and power backplanes. Its versatility and performance make it a valuable asset in many high-demand environments.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners