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2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications

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    Buy cheap 2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications from wholesalers
     
    Buy cheap 2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications from wholesalers
    • Buy cheap 2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications from wholesalers

    2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications

    We are excited to introduce our newly shipped PCB: the RF-60TC PCB. Designed specifically for the rigorous demands of RF and microwave applications, the RF-60TC PCB sets a new standard in high-frequency technology.


    Key Features of RF-60TC PCBs

    The RF-60TC PCB is constructed from a unique ceramic-filled, glass-reinforced PTFE laminate, providing numerous advantages over traditional materials. Key features include:


    - High Thermal Conductivity: With thermal conductivity values up to 1.05 W/M*K (1 oz copper), the RF-60TC efficiently dissipates heat, crucial for maintaining performance in high power applications.

    - Dielectric Constant of 6.15: At 10 GHz, this characteristic ensures excellent signal integrity and minimal signal loss.

    - Low Dissipation Factor: A low dissipation factor of 0.002 at 10 GHz/23°C enhances efficiency, particularly in high-gain applications.


    RF-60TC Typical Values
    PropertyTest MethodUnitValueUnitValue
    Dk @ 10 GHzIPC-650 2.5.5.5.1 (Modified)6.15 ± 0.156.15 ± 0.15
    Df @ 10 GHzIPC-650 2.5.5.5.1 (Modified)0.0020.002
    TcKppm/°C-3.581ppm/°C-3.581
    Dielectric BreakdownIPC-650 2.5.6kV55kV55
    Dielectric StrengthIPC-650 2.5.6.2V/mil550V/mm21,654
    Arc ResistanceIPC-650 2.5.1Seconds>180Seconds>180
    Moisture AbsorptionIPC-650 2.6.2.1%0.03%0.03
    Flexural Strength (MD)IPC-650 2.4.4psi10,000N/mm269
    Flexural Strength (CD)IPC-650 2.4.4psi9,000N/mm262
    Tensile Strength (MD)IPC-650 2.4.19psi9,000N/mm262
    Tensile Strength (CD)IPC-650 2.4.19psi7,000N/mm248
    Young’s Modulus (MD)ASTM D 3039/IPC-TM-650 2.4.19kpsi721N/mm24971
    Poisson’s Ratio (MD)ASTM D 3039/IPC-TM-650 2.4.190.1550.155
    Peel Strength (1 oz. ED)IPC-650 2.4.8lbs/in8N/mm1.43
    Thermal Conductivity (Unclad)IPC-650 2.4.50W/M*K0.9W/M*K0.9
    Thermal Conductivity (CH/CH)IPC-650 2.4.50W/M*K1W/M*K1
    Thermal Conductivity (C1/C1)IPC-650 2.4.50W/M*K1.05W/M*K1.05
    Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.01mm/M0.01
    Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.69mm/M0.69
    Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.06mm/M0.06
    Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.8mm/M0.8
    Surface ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm1.0 x 108Mohm1.0 x 108
    Volume ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm/cm1.0 x 108Mohm/cm1.0 x 108
    CTE (X, Y axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C9.9ppm/°C9.9
    CTE (Z axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C40ppm/°C40
    Density (Specific Gravity)IPC-650 2.3.5g/cm32.84g/cm32.84
    Specific HeatIPC-650 2.4.50J/gK0.94J/gK0.94
    Td (2% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F930°C500
    Td (5% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F960°C515
    Flammability RatingUL 94V-0V-0

    Thermal Conductivity and Its Importance

    Effective thermal management is vital in high-frequency applications. The RF-60TC PCB's superior thermal conductivity enables lower operating temperatures, extending the lifespan of active components and improving long-term reliability. This feature is particularly beneficial in environments where heat buildup can compromise performance.


    Dielectric Properties That Enhance Performance

    The RF-60TC PCB boasts excellent dielectric properties, including a stable dielectric constant over frequency and temperature. With a thermal coefficient of dielectric constant (Dk) of -3.58 ppm/°C, the RF-60TC maintains signal integrity across a wide range of temperatures, making it suitable for diverse operational conditions.


    Dimensional Stability for Complex Designs

    One of the standout features of the RF-60TC PCB is its dimensional stability, with low thermal coefficients of expansion (CTE) of 9.9 ppm/°C (X/Y axis) and 40 ppm/°C (Z axis). This stability is essential for building high-layer count multilayer PCBs, ensuring reliable plated through hole connections and maintaining performance integrity throughout the PCB's lifespan.


    Rigorous Quality Assurance Standards

    At Bicheng, quality assurance is paramount. Each PCB from us undergoes comprehensive 100% electrical testing before shipment, adhering to IPC-Class-2 standards. This rigorous testing ensures that every PCB meets high-performance expectations, providing confidence to engineers and designers.


    PCB Material:PTFE based, ceramic filled fiberglass
    Designation:RF-60TC
    Dielectric constant:6.15
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm)
    PCB thickness:10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

    Applications of RF-60TC PCBs in Various Industries

    The versatility of the RF-60TC PCB allows it to excel in numerous applications, including:


    - High Power Amplifiers: Ideal for RF power amplifiers that require efficient heat dissipation and reliable performance.

    - Miniaturized Antennas: Perfect for compact designs, such as GPS antennas and RFID readers, where space is a premium.

    - Filters, Couplers, and Dividers: Essential components in RF systems, the RF-60TC PCB supports advanced signal management.

    - Satellite Communications: Designed to meet the demanding requirements of satellite technology, ensuring robust performance in critical applications.


    Comparison with Traditional PCB Materials

    Compared to traditional PCB materials, the RF-60TC offers superior performance characteristics. Its enhanced thermal conductivity, low dielectric losses, and dimensional stability make it a preferred choice for high-frequency applications, enabling engineers to push the boundaries of design and functionality.


    2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications


    Future Trends in PCB Technology

    As the electronics industry continues to evolve, the demand for high-performance PCBs like the RF-60TC is expected to grow. Innovations in materials and manufacturing processes will lead to even more advanced solutions that enhance performance and reliability in RF and microwave applications.


    Conclusion and Contact Information

    At Bicheng, we are committed to providing high-frequency PCB solutions that meet the needs of modern electronic applications. The RF-60TC PCB represents a significant advancement in high-frequency technology, combining exceptional thermal management, low dielectric losses, and robust construction.


    For more information or to discuss specific requirements, please contact our sales team at sales10@bichengpcb.com. We are dedicated to delivering the highest quality products and exceptional support to help you achieve your project goals.

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