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Brand Name : | Bicheng |
Certification : | UL, ISO9001, IATF16949 |
Price : | USD9.99-99.99/PCS |
Payment Terms : | T/T |
Supply Ability : | 5000PCS per month |
Delivery Time : | 8-9 working days |
Introducing the TFA294 PCB, featuring a cutting-edge Polytetrafluoroethylene ceramic composite dielectric substrate renowned for its exceptional electrical, thermal, and mechanical properties. The TFA series is crafted using a unique process that blends PTFE resin and ceramics to create prefabricated sheets, offering superior performance compared to traditional methods.
Unmatched Performance Features
1. Dielectric Constant (Dk) of 2.94 at 10GHz: Ensures precise
signal propagation and minimal signal loss at high frequencies.
2. Dissipation Factor: With a dissipation factor of .0010 at 10GHz
and 20GHz, and 0.0012 at 40GHz, this PCB guarantees efficient
signal transmission without compromising performance.
3. Thermal Stability: Offering a low Thermal Coefficient of
Dielectric Constant (TCDK) at -5 ppm/°C, the board maintains
stability across a wide temperature range (-55°C to 150°C).
4. Controlled Thermal Expansion: The Coefficient of Thermal
Expansion (CTE) values of 18 ppm/°C (x-axis), 18 ppm/°C (y-axis),
and 32 ppm/°C (z-axis) ensure reliable performance under varying
thermal conditions (-55°C to 288°C).
5. Enhanced Thermal Conductivity: With a thermal conductivity of
0.59 W/mk, the PCB efficiently dissipates heat, reducing the risk
of thermal issues in high-power applications.
6. Moisture Resistance: Featuring a low moisture absorption rate of
0.03%, the PCB maintains its electrical properties even in humid
environments.
7. Safety Standards: The PCB is UL 94-V0 certified, ensuring compliance with stringent safety regulations.
Construction and Specifications
PCB Stackup: This 2-layer rigid PCB incorporates a TFA294 core
(0.127mm) sandwiched between two copper layers (35 μm each),
offering a robust foundation for high-frequency circuits.
Board Dimensions: Sized at 58.1mm x 66mm with tight tolerances (+/-
0.15mm), the PCB is optimized for compact applications.
Manufacturing Details: With a finished board thickness of 0.25mm,
1oz outer layer copper weight, and 20 μm via plating thickness, the
PCB is meticulously crafted to meet performance requirements.
Quality Assurance: The PCB undergoes 100% electrical testing before shipment, ensuring adherence to IPC-Class-2 quality standards.
Applications and Versatility
The TFA294 PCB finds applications in a diverse range of industries,
including aerospace, communications, radar systems, and power
amplification. Its reliability, high-frequency performance, and
thermal stability make it ideal for:
Aerospace Equipment: Suitable for aerospace navigation systems,
in-cabin equipment, and aircraft components.
Communications Infrastructure: Ideal for microwaves, antennas,
phased array antennas, and satellite communication systems.
Radar Systems: Well-suited for early warning radars, airborne
radars, phased array antennas, and beamforming networks.
Power Amplification: Ensures efficient signal amplification in high-power applications.
Global Availability and Support
With worldwide availability and compatibility with Gerber RS-274-X
artwork, the TFA294 Core PCB is ready to meet the needs of global
customers seeking high-performance solutions for their electronic
projects.
In conclusion, the TFA294 Core PCB stands as a testament to innovation and excellence in PCB technology. Its advanced features, superior performance, and versatility make it a preferred choice for demanding applications where reliability and precision are paramount. If you are interested in our PCB, please contact our sales team at sales10@bichengpcb.com.
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